The solder contacts are completely free of phosphorus, sulfur or other impurities. This is the prerequisite for excellent solder joints, as only in this way can very clean intermetallic phases form during soldering.
The sensors can be used at temperatures of up to 250 °C and can withstand soldering processes of over 300 °C without any problems. They can be processed by a variety of methods, such as:
- Soldering with lead-free solder
- Soldering with leaded solder
- High temperature solder (HMP)
- Low temperature solder (LMPs)
- Lead bonding
- Ultrasonic wire bonding