{{request_inquiry}}
#
ps-1
Overview
title
Produkt Details
SKU
906146
Name

Platinum-chip temperature sensors SMDFCB-L-AuNi

Description
Platinum chip temperature sensors belong to the category of temperature sensors that were made using thin-film technology. Sensors of the SMDFCB design type have a single-sided contact (flip chip) and are equipped with a solderable nickel-gold metallization on the back cover. The metal layer enables direct thermal contact with another body via a solder connection.
Short Description
in SMD design type (flip chip) with metallized back cover according to DIN EN IEC 60751
Price
€0.00
Availability
In Stock
Images
  • Platinum-chip temperature sensors SMDFCB-L-AuNi
State
LIVE
cf-data
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
title
Icon
icon-chip
Description
Solderable metallized back cover
Icon
icon-success
Description
For confined spaces
Icon
icon-masszeichnung
Description
SMD size SMD 0805
title

Technical data

datasheet
https://www.jumo.net/attachments/JUMO/attachmentdownload?id=1234240
Design type
SMDFCB-L-AuNi
Standard
DIN EN IEC 60751
Temperature range
-70 to +250 °C
Temperature coefficient
α = 3.850 × 10-3 °C-1 (between 0 and 100 °C)
Connection
Gold-plated nickel solder contact, thickness of nickel layer ≥ 1 µm, gold ≥ 40 nm, solderability according to IEC / DIN EN 60068-2-58
Processing
Reflow soldering
Metallized back cover
Nickel/gold
Advantages
Solderable back cover for better thermal contact, for confined spaces, SMD size 0805, single side contact (flip chip design type), high-purity and even contact layer for better solder connection, high measuring accuracy, high long-term stability, standardized nominal values and tolerances, fast response behavior
ps-2
Downloads
ps-3
Accessories
title

Accessories

Are you looking for support?

We will assist you with your project and provide you with an offer tailored to your personal needs.
We care about your problems and will find solutions for you. We are also the contact persons for startup